Acknowledgements


The UCB-TCAD group is grateful to the Semiconductor Research Corporation, DARPA, the semiconductor industry, and NSF for supoorting the development of our process simulation programs. The Semiconductor Research Corporation has provided very significant support for the modeling and simulation of lithography since 1988, and SRC together with DARPA are now supporting TCAD as a cross-cutting technology for lithography at 100 nm and beyond.

SRC

DARPA


These UCB-TCAD web pages and computational resources used in running our simulators from the web are made possible by a major equipement grant from Intel which evolved from a mutual interest in advanced EUV lithography.

Intel


We would also like to acknowledge persons and organizations who have allowed us to redistribute their codes as part of our web project.
Kenny K.H. Toh for the free download of the 50,000 line plotmtv program for viewing surface representations in three dimensions which he developed as a personal project.

Kenny Toh


Microimages, Inc. for the free X server interface for the Windows 95/NT platform. These X servers were developed in support of Microimages' geospatial analysis products: TNTmips, TNTview, TNTatlas, and TNTlite.

Microimages


We would also like to acknowledge the following contributions to the tools used in web development.

Sun Microsystems

Netscape

Microsoft